From Sand to Silicon “Making of a Chip” Illustrations May 2009


Class Testing / Completed Processor



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Class Testing / Completed Processor
Class Testing –
scale: package level (mm /
1 inch)

During this final test the processors will be tested for their key characteristics among the tested characteristics are power dissipation and maximum frequency).
Binning –
scale: package level (mm /
1 inch)

Based on the test result of class testing processors with the same capabilities are put into the same transporting trays.
Retail Package –
scale: package level (mm /
1 inch)

The readily manufactured and tested processors (again Intel Core i Processor is shown here) either go to system manufacturers in trays or into retail stores in a box such as that shown here.

Copyright © 2009, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the US. and other countries.
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