From Sand to Silicon “Making of a Chip” Illustrations May 2009


Wafer Sort Test / Slicing



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Wafer Sort Test / Slicing
Wafer Sort Test –
scale: die level (mm /
0.5 inch)

This fraction of a ready wafer is being put to a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to the right answer.
Wafer Slicing –
scale: wafer level (mm / 12 inch)
The wafer is cut into pieces (called dies).
Discarding faulty Dies –
scale: wafer level (mm / 12 inch)
The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging).

Copyright © 2009, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the US. and other countries.
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Packaging
Packaging –
scale: package level (mm /
1 inch)

The substrate, the die and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be put onto. This will keep the processor cool during operation.
Individual Die –
scale: die level (mm /
0.5 inch)

This is an individual die which has been cutout in the previous step (slicing. The die shown here is a die of an Intel Core i Processor .
Processor –
scale: package level (mm /
1 inch)

Completed processor (Intel Core i Processor in this case. A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps – only the most important ones have been visualized in this picture story - in the world's cleanest environment (a microprocessor fab) to make microprocessors.

Copyright © 2009, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the US. and other countries.
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